Zhuzhou Jiabang Refractory Metal Co., Ltd

Zhuzhou Jiabang Refractory Metal Co., Ltd

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W75Cu25 Copper Tungsten Alloy Sheet For Heat Sink , Low Thermal Expansion

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Zhuzhou Jiabang Refractory Metal Co., Ltd
City:zhuzhou
Province/State:hunan
Country/Region:china
Contact Person:MsWu
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W75Cu25 Copper Tungsten Alloy Sheet For Heat Sink , Low Thermal Expansion

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Brand Name :JBNR
Certification :ISO 9001
Place of Origin :China
MOQ :1 piece
Price :Netotiable
Payment Terms :L/C, T/T, Western Union, MoneyGram
Supply Ability :5 Ton per month
Packaging Details :Standard for exporting
Material :75% tungsten ,25% copper
Sized :customized
Density :13.8 g/cm3
Hardness :175HB Kgf/mm2≥
Resistivity :54.1 µΩ.cm≤
IACS :42%≥
Bending strength :790 Mpa
Application :Heat Sink
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Good quality Copper tungsten sheet W75Cu25

Tungsten copper alloys are used where the combination of high heat resistance, high electrical and/or thermal conductivity, and low thermal expansion are needed. Some of the applications are in electric resistance welding, as electrical contacts, and as heat sinks. As contact material the alloy is resistant to erosion by electric arc. WCualloys are also used in electrodes for electrical discharge machining and electrochemical machining.

Advantages

Higer thermal conductivity

Low thermal expansion

High arc resistance combined with good electrical conductivity

Applications

Heat Sinks
The CuW75 tungsten copper alloy is used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-power electronic devices. As a tungsten copper material, it's a composite, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized.
The combination of tungsten & copper materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of tungsten copper's thermal conductivity and expansion characteristics, Tungsten copper alloy works well in densely packed circuits.

Tungsten CopperTechnical Data

Grade No Chemical Composition % Density Hardness Resistivity IACS Bending Strength
Cu Impurity Wolfram g/cm3≥ HB Kgf/mm2≥ µΩ.cm≤ %≥ Mpa≥
W50/Cu50 50±2.0 0.5 Balance 11.85 115 3.2 54
W55/Cu45 45±2.0 0.5 Balance 12.3 125 3.5 49
W60/Cu40 40±2.0 0.5 Balance 12.75 140 3.7 47
W65/Cu35 35±2.0 0.5 Balance 13.3 155 3.9 44
W70/Cu30 30±2.0 0.5 Balance 13.8 175 4.1 42 790
W75/Cu25 25±2.0 0.5 Balance 14.5 195 4.5 38 885
W80/Cu20 20±2.0 0.5 Balance 15.15 220 5.0 34 980
W85/Cu15 15±2.0 0.5 Balance 15.9 240 5.7 30 1080
W90/Cu10 10±2.0 0.5 Balance 16.75 260 6.5 27 1160
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