Tungsten-Copper (W-Cu) Electronic Packing Component Heat Sink Description: Copper Tungsten is one of the most popular refractory metal based heat sink ...
Tungsten-Copper (W-Cu) Electronic Packing Component Heat Sink Description: Copper Tungsten is one of the most popular refractory metal based heat sink ...
Molybdenum Copper Heat Sink For High Power RF, Microwave, Semiconductor Packaging, Optical Communication Description: Mo-Cu composite is similar with ...
Molybdenum Copper Heat Sink For High Power RF, Microwave, Semiconductor Packaging, Optical Communication Description: Mo-Cu composite is similar with ...
Cu-Mo-Cu (CMC) Sandwich Heat Sink of Electronic Packing Materials Description: Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer ...
Cu-Mo-Cu (CMC) Sandwich Heat Sink of Electronic Packing Materials Description: Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer ...