Zhuzhou Jiabang Refractory Metal Co., Ltd

Zhuzhou Jiabang Refractory Metal Co., Ltd

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Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink

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Zhuzhou Jiabang Refractory Metal Co., Ltd
City:zhuzhou
Province/State:hunan
Country/Region:china
Contact Person:MsWu
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Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink

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Brand Name :JBNR
Model Number :50WCu,75WCu,80WCu,85WCu,90WCu
Certification :ISO9001
Place of Origin :CHINA
MOQ :Negotiation
Price :Negotiable
Payment Terms :L/C, , T/T, Western Union
Delivery Time :15days
Packaging Details :as customer required
Material :tungsten copper
Density :16.4
CTE :7.2
TC :180-190
Plating :gold
Application :High power device
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Low CTE Copper Tungsten Electronic Packaging Materials WCu Heat Sink

Description:

CuW, also called copper tungsten, tungsten copper and W-Cu, is a powdered metal product consisting of a mixture of copper and tungsten (a.k.a. wolfram).

Our heat sink are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.


Advantages:

High thermal conductivity

Excellent hermeticity

Excellent flatness, surface finish, and size control

Semi-finished or finished (Ni/Au plated) products available


Product Properties:

Grade Wt%(W) Wt%(Cu) Density
at 20ºC
Thermal conductivity at 25ºC Coefficient of thermal expansion at 20ºC
W90Cu10 90±1 rest 17.0g/cm3 180-190 6.5
W85Cu15 85±1 rest 16.4g/cm3 190-200 7.0
W80Cu20 80±1 rest 15.6g/cm3 200-210 8.3
W75Cu25 75±1 rest 14.9g/cm3 220-230 9.0
W50Cu50 50±1 rest 12.2g/cm3 310-340 12.5



Application:

Applies to high-power device package of materials, such as substrates; high-performance lead frame; military and civilian thermal control devices such as thermal control panels and radiators.


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Low CTE Copper Tungsten Alloy Electronic Packaging Materials WCu Heat Sink

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