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High Thermal Expansion Molybdenum Copper Cu/MoCu/Cu(CPC) sheet
Description:
Grade | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Coefficient of thermal Expansion ×10-6 (20℃) |
CPC141 | 9.5 | 7.3 | 280(XY)/170(Z) |
CPC232 | 9.3 | 10.2 | 255(XY)/250(Z) |
Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount,mobile phone base stations.
Product picture: