Zhuzhou Jiabang Refractory Metal Co., Ltd
Zhuzhou Jiabang Refractory Metal Co., Ltd
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Excellent Thermal Expansion Coefficient Of Molybdenmum Copper Base Plate For LDMOS
Description:
Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.
Advantages:
1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.
2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.
Product Properties:
| Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 70MoCu | 70±2% | 9.8 | 7 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 7.5 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.