
Add to Cart
Excellent X-Y Expansion Cross-rolled Moly Copper Sheet For Supporting Cases For I/C Packaging
Description:
With adjustable thermal expansion coefficient and thermal conductivity, Molybdenum Copper Sheet (MoCu) is a suitable material for heat cooling in microelectronic industry. And the density of molybdenum copper is equal or below 10.01 which is much smaller than that of tungsten copper.
For some specific industry like automobile and aerospace, Molybdenum Copper Heatsinks is a better choice.
We can provide moly copper sheet, moly copper roll, moly copper plate for your following machining, plating.
Advantages:
1. high thermal conductivity and excellent hermeticity.
2. 40% lighter weight compared to WCu materials.
Product Properties:
Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
85MoCu | 85±2% | 10.01 | 7 | 200(25℃)/156(100℃) |
80MoCu | 80±2% | 9.9 | 7 | 170(25℃)/190(100℃) |
70MoCu | 70±2% | 9.8 | 7.3 | 200(25℃)/196(100℃) |
60MoCu | 60±2% | 9.66 | 8.4 | 222(25℃)/217(100℃) |
50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.