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Zhuzhou Jiabang Refractory Metal Co., Ltd

City:zhuzhou

Province/State:hunan

Country/Region:china

Contact Person:MsWu

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China Cu / Mo70Cu / Cu CPC Mocu Heat Sink And Shims For High Power Device wholesale

Cu CPC Mocu Heat Sink And Shims For High Power Device

Name: Cu Mo70Cu Cu CPC Mocu Heat Sink And Shims For High Power Device
Brand: JBNR
Price: 1 USD

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Brand Name :JBNR

Model Number :CPC141,CPC232,CPC300

Place of Origin :CHINA

MOQ :Negotiation

Price :Negotiable

Payment Terms :L/C, , T/T, Western Union

Delivery Time :15days

Packaging Details :as customer required

Material :copper/moly copper/copper

Density :9.2

CTE :9.5

TC :260

Application :RF Power Device Package

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Cu / Mo70Cu / Cu (CPC) Heat Sinks and Shims For High Power Device

Description:

Cu/Mo70Cu/Cu is a sandwich composite similar to that of Cu/Mo/Cu with a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1: 4: 1. It has different CTE in X and Y direction, with higher thermal conductivity than that of W(Mo)Cu &Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.

Advantages:
1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost

4.No magnetism

Product Properties:

Grade

Density g/cm³

Coefficient of thermal

Expansion ×10^-6(20℃)

Coefficient of thermal

Expansion ×10^-6(20℃)

CPC141

9.5

7.3

280(XY)/170(Z)

CPC232

9.3

10.2

255(XY)/250(Z)

Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount,mobile phone base stations.

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