Zhuzhou Jiabang Refractory Metal Co., Ltd
Zhuzhou Jiabang Refractory Metal Co., Ltd
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Thermal Buffer Molybdenum Copper Substrate Welded To DBC On Chip
Description:
With adjustable thermal expansion coefficient and thermal conductivity, Molybdenum Copper Heat sink (MoCu) is a suitable material for heat cooling in microelectronic industry. And the density of molybdenum copper is equal or below 10.01 which is much smaller than that of tungsten copper.
For some specific industry like automobile and aerospace, Molybdenum Copper Heatsinks is a better choice.
Customers normally choose moly copper as heat sink and then they will weld DBC onto the heat sink.
Advantages:
1. high thermal conductivity and excellent hermeticity.
2. 40% lighter weight compared to WCu materials.
Product Properties:
| Grade | Mo Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 85MoCu | 85±2% | 10.01 | 7 | 200(25℃)/156(100℃) |
| 80MoCu | 80±2% | 9.9 | 7 | 170(25℃)/190(100℃) |
| 70MoCu | 70±2% | 9.8 | 7.3 | 200(25℃)/196(100℃) |
| 60MoCu | 60±2% | 9.66 | 8.4 | 222(25℃)/217(100℃) |
| 50MoCu | 50±2% | 9.5 | 10.2 | 250(25℃)/220(100℃) |
Application:
Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.